Split transfer gate for dark current suppression an imager pixel

ABSTRACT

A pixel with a photosensor and a transfer transistor having a split transfer gate. A first section of the transfer gate is connectable to a first voltage source while a second section of the transfer gate is connectable to a second voltage source. Thus, during a charge integration period of a photosensor, the two sections of the transfer gate may be oppositely biased to decrease dark current while controlling blooming of electrons within and out of the pixel cell. During charge transfer the two gate sections may be commonly connected to a positive voltage sufficient to transfer charge from the photosensor to a floating diffusion region.

The present application is a divisional of application Ser. No.11/019,232, filed Dec. 23, 2004, the entire disclosure of which isincorporated herein by reference.

FIELD OF THE INVENTION

The present invention relates generally to semiconductor devices, andmore particularly, to transfer transistor technology, for use in imagerpixels.

BACKGROUND OF THE INVENTION

CMOS image sensors are increasingly being used as low cost imagingdevices. A CMOS image sensor circuit includes a focal plane array ofpixel cells, each one of the cells includes a photosensor, such as e.g.,a photogate, photoconductor, or photodiode having an associated chargeaccumulation region within a substrate for accumulating photo-generatedcharge. Each pixel cell may include a transistor for transferring chargefrom the charge accumulation region to a sensing node, and a transistorfor resetting the sensing node to a predetermined charge level prior tocharge transference. The pixel cell may also include a source followertransistor for receiving and amplifying charge from the sensing node andan access transistor, for controlling the readout of the cell contentsfrom the source follower transistor.

In a CMOS image sensor, the active elements of a pixel cell perform thenecessary functions of: (1) photon to charge conversion; (2)accumulation of image charge; (3) transfer of charge to the sensing nodeaccompanied by charge amplification; (4) resetting the sensing node to aknown state before the transfer of charge to it; (5) selection of apixel for readout; and (6) output and amplification of a signalrepresenting pixel charge from the sensing node.

CMOS image sensors of the type discussed above are generally known asdiscussed, for example, in Nixon et al., “256×256 CMOS Active PixelSensor Camera-on-a-Chip,” IEEE Journal of Solid-State Circuits, Vol.31(12), pp. 2046-2050 (1996); and Mendis et al., “CMOS Active PixelImage Sensors,” IEEE Transactions on Electron Devices, Vol. 41(3), pp.452-453 (1994). See also U.S. Pat. Nos. 6,177,333 and 6,204,524, whichdescribe the operation of conventional CMOS image sensors and areassigned to Micron Technology, Inc., the contents of which areincorporated herein by reference.

A top-down view of a conventional CMOS pixel cell 10 is shown in FIG. 1.The illustrated CMOS pixel cell 10 is a four transistor (4T) cell. TheCMOS pixel cell 10 generally comprises a photo-conversion device 13,e.g., a photodiode, for generating and collecting charge in response tolight incident on the pixel cell 10, and a transfer transistor having agate 7 for transferring photoelectric charges from the photo-conversiondevice 13 to a sensing node, which is typically a floating diffusionregion 3. The floating diffusion region 3 is electrically connected tothe gate 27 of an output source follower transistor. The pixel cell 10also includes a reset transistor having a gate 17 for resetting thefloating diffusion region 3 to a predetermined voltage; and a row selecttransistor having a gate 37 for outputting a signal from the sourcefollower transistor 27 to an output terminal in response to an addresssignal on gate 37.

FIG. 2 is a cross-sectional view of a portion of the pixel cell 10 ofFIG. 1, taken along line 2-2′, showing the photo-conversion device 13constructed as a photodiode, transfer transistor having a gate 7 andreset transistor having a gate 17. The CMOS pixel cell 10 has aphoto-conversion device 13 that may be formed as a pinned photodiode.The illustrated photodiode has a p-n-p construction comprising a p-typesurface layer 5 and an n-type photodiode charge collection region 14within a p-type substrate 2. The photodiode 13 is adjacent to andpartially underneath the gate 7 of the transfer transistor. The resettransistor gate 17 is on a side of the transfer transistor gate 7opposite the photodiode 13. As shown in FIG. 2, the reset transistorincludes a source/drain region 32, which is adjacent an isolation region9. The floating diffusion region 3 is located between the gates 7, 17 ofthe transfer and reset transistor.

In the CMOS pixel cell 10 depicted in FIGS. 1 and 2, electrons aregenerated by light incident on the photodiode 13 and are stored in then-type photodiode region 14. These charges are transferred to thefloating diffusion region 3 by the transfer transistor when the transfertransistor gate 7 is turned on. The source follower transistor producesan output signal from the transferred charges which are stored in thefloating diffusion region 3.

One common problem associated with conventional imager pixel cells, suchas pixel cell 10, is dark current, that is, current generated as aphotodiode signal in the absence of light. Dark current may be caused bymany different factors, including: photodiode junction leakage, leakagealong isolation edges, transistor sub-threshold leakage, drain inducedbarrier lower leakage, gate induced drain leakage, trap assistedtunneling, and pixel fabrication defects. One example of a defect is aninterstitial vacancy state in the charge carrier-depletion region. Thisdefect causes increased thermal generation of electron-hole pairs, whichmay be collected in the photodiode 13 (FIG. 2) and effectively loweroverall image quality.

The area directly under the edge of the transfer transistor gatestack 17is a significant source of dark current. The n-type accumulation region14 of photodiode 13 is formed close to the surface of the substrate 2under the transfer gatestack 17 in order to reduce charge lag. Thiscauses the depletion region created during an integration period for thepixel cell 10, and being associated with the n-type accumulation region14 and the p-type surface region 5, to also be close to the surface ofthe substrate 2 in this area. The presence of the depletion region in anarea that already has defects causes large numbers of thermally-createdelectron-hole pairs to be present in this area near the transfertransistor gatestack 17 edge. When the photodiode 13 is reset with areset voltage applied on the reset gate 17, a reverse bias electricfield sweeps the thermally created holes into the p-type surface region5 and the thermally created charge carriers over to the n-typecollection area 14 of the photodiode 13. These thermally generatedcharge carriers increase the unwanted dark current for image pixel cell10.

One possible solution to reducing the dark current generation underneaththe transfer transistor gatestack is to apply a negative voltage on thetransfer transistor's gate. The negative voltage attracts electron-holepairs to the surface, decreasing the depletion region there andeffectively covering the interstitial vacancy state. Accordingly, with anegative voltage applied to the transfer transistor gate, thermallygenerated electron-hole pairs will likely recombine before thephotodiode can collect them. This solution, however, tends to aggravateanother problem, referred to as blooming. Blooming occurs when thestorage capacity of the photodiode is full and electrons are still beinggenerated even though the photodiode is full. The extra electrons canbloom to several locations. The extra electrons may attempt to diffuseby jumping across isolation barriers into adjacent pixels, corruptingtheir signals. Alternatively, the electrons may travel through thesubstrate and be collected in other areas of the pixel or in peripherycircuit devices. The floating diffusion region is the most desirableplace for the extra electrons to be collected. The floating diffusionregion has considerable capacity to store these stray electrons duringimager operation and the signal on the floating diffusion region iscleared or reset before the pixel signal is actually read.

Positively biasing the transfer transistor gate 7 makes extra electronsmore likely to bloom through the transfer transistor to the floatingdiffusion region 3. However, applying a negative bias to the transfertransistor gate 7, which is desirable to prevent dark currentpenetration, makes it more difficult for the extra electrons to bloom tothe floating diffusion region 3, thus causing blooming into otherundesirable regions of a pixel or adjacent pixels. Moreover, assuggested above, a positively biased transfer transistor gate 7increases the dark current as a result of a larger depletion regionunder the transfer transistor gate 7.

Therefore, a pixel having a decreased dark current without negativeblooming effects is desired. Also needed is a simple method offabricating and operating such a pixel.

BRIEF SUMMARY OF THE INVENTION

The present invention, as described in various exemplary embodiments,provides a pixel with a transfer transistor having a split transfergate. A first section of the transfer gate is connectable to a firstvoltage source while a second section of the transfer gate isconnectable to a second voltage source. Thus, during a chargeintegration period of a photosensor, the two sections of the transfergate may be oppositely biased to decrease dark current while controllingblooming of electrons within and out of the pixel. During chargetransfer the two gate sections may be commonly connected to a positivevoltage sufficient to transfer charge from the photosensor to a floatingdiffusion region.

In accordance with one exemplary embodiment of the invention, the firstand second gate sections are located adjacent one another, over a gateoxide layer, and are separated by an isolation region.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other aspects of the invention will be betterunderstood from the following detailed description of the invention,which is provided in connection with the accompanying drawings, inwhich:

FIG. 1 is a top-down view of a conventional four transistor (4T) pixelcell;

FIG. 2 is a cross-sectional view of the pixel cell of FIG. 1 taken alongline 2-2′;

FIG. 3 is a cross-sectional view of a first exemplary embodiment of apixel cell constructed in accordance with the invention;

FIG. 4 is a diagram depicting a method of operating an exemplary pixelcell in accordance with the invention;

FIG. 5A is a cross-sectional view of portions of the exemplary pixelcell of FIG. 3 at an initial stage of fabrication;

FIG. 5B is a cross-sectional view of portions of the exemplary pixelcell of FIG. 3 at a stage of fabrication subsequent to FIG. 5A;

FIG. 5C is a cross-sectional view of portions of the exemplary pixelcell of FIG. 3 at a stage of fabrication subsequent to FIG. 5B;

FIG. 5D is a cross-sectional view of portions of the exemplary pixelcell of FIG. 3 at a stage of fabrication subsequent to FIG. 5C;

FIG. 5E is a cross-sectional view of portions of the exemplary pixelcell of FIG. 3 at a stage of fabrication subsequent to FIG. 5D;

FIG. 5F is a cross-sectional view of portions of the exemplary pixelcell of FIG. 3 at a stage of fabrication subsequent to FIG. 5E;

FIG. 6 is a top-down view of a pixel cell constructed in accordance witha second exemplary embodiment of the invention;

FIG. 7 is a top-down view of a pixel cell constructed in accordance witha third exemplary embodiment of the invention;

FIG. 8 is a top-down view of a pixel cell constructed in accordance witha fourth exemplary embodiment of the invention;

FIG. 9 is a top-down view of a pixel cell constructed in accordance witha fifth exemplary embodiment of the invention;

FIG. 10 is a block diagram of a CMOS image sensor according to anexemplary embodiment of the invention; and

FIG. 11 is a diagram of a computer processor system incorporating anexemplary CMOS image sensor of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

In the following detailed description, reference is made to theaccompanying drawings, which form a part hereof and illustrate specificembodiments in which the invention may be practiced. In the drawings,like reference numerals describe substantially similar componentsthroughout the several views. These embodiments are described insufficient detail to enable those skilled in the art to practice theinvention, and it is to be understood that other embodiments may beutilized, and that structural, logical and electrical changes may bemade without departing from the spirit and scope of the presentinvention.

The terms “wafer” and “substrate” are to be understood as includingsilicon, silicon-on-insulator (SOI), silicon-on-sapphire (SOS), andsilicon-on-nothing (SON) technology, doped and undoped semiconductors,epitaxial layers of silicon supported by a base semiconductorfoundation, and other semiconductor structures. Furthermore, whenreference is made to a “wafer” or “substrate” in the followingdescription, previous process steps may have been utilized to formregions or junctions in the base semiconductor structure or foundation.In addition, the semiconductor need not be silicon-based, but could bebased on silicon-germanium, germanium, or gallium-arsenide.

The term “pixel” or “pixel cell” refers to a picture element unit cellcontaining a photo-conversion device and transistors for convertingelectromagnetic radiation to an electrical signal. For purposes ofillustration, a portion of a representative pixel cell is illustrated inthe figures and description herein, and typically fabrication of allpixel cells in an image sensor will proceed concurrently and in asimilar fashion.

FIG. 3 is a cross-sectional and partial schematic circuit view of apixel cell 100 according to an exemplary embodiment of the invention.The pixel cell 100 has a split transfer gate electrode, havingtwo-sections 106, 108, as a part of transfer transistor 107. As shown,both of the two sections 106, 108 of the transfer gate electrode arelocated above a gate oxide layer 104 and beneath an insulating cap layer110. During imager use, the two sections 106, 108 of the gate electrodemay be respectively connected to a control circuit 131 for controllingthe application of a respective first and second voltage potential V₁,V₂.

In the exemplary pixel cell 100, the transfer gate of the transfertransistor 107 is located between a photodiode 113 and a floatingdiffusion region 103. The photodiode 113 is illustratively a p-n-pphotodiode, comprising a p-type surface region 105 located over ann-type accumulation region 114, in a p-type substrate 102. The inventionmay also be utilized, however, with other photosensitive elements and isnot limited to the layout of the illustrated photodiode 113.

The transfer transistor 107 acts to transfer accumulated photo-chargesfrom the n-type accumulation region 114 to the floating diffusion region103. A reset transistor 117 is located on an opposite side of thefloating diffusion region 103 from the transfer transistor 107. Asource/drain region 132 is located in the substrate 102 on a second sideof the reset transistor 117 and is capable of receiving a supply voltageV_(aa-pix). Adjacent the source drain region is a shallow trenchisolation (STI) region 109. A similar STI region 109 is constructed onthe other side of the pixel cell as well, adjacent the photodiode region113 to provide isolation for the pixel cell 100. The floating diffusionregion 103 is also electrically connected to the gate of a sourcefollower transistor 127 having a drain coupled to V_(aa-pix), whichcreates a voltage signal based on stored charge on the floatingdiffusion region 103. A row select transistor 137 has a drain connectedto the source of the source follower transistor 127 for selectivelyreading out the pixel signal to a column line.

FIG. 4 illustrates an exemplary method 150 of operating the exemplarypixel cell 100. An integration period begins at step 201 as light isapplied to the pixel cell 100 to capture an image. This can be doneusing any known method for beginning an integration period, such as theuse of a mechanical or electronic shutter. As shown in steps 202A and202B during the integration period, the control circuit 131 (FIG. 3)applies a first voltage V₁ to a terminal at the first section 106 of thetransfer gate electrode, and a second voltage V₂ is applied to aterminal at the second section 108 of the transfer gate electrode. Inaccordance with a preferred embodiment of the invention, the firstvoltage V₁ is a slightly negative voltage so that the depletion regionis pulled away from the surface of the silicon near the edge of thetransfer gate of transfer transistor 107 (FIG. 3). The first voltage V₁may be in the range of about −0.1 to about −1.0 volts. At the same time(202B), a slightly positive voltage V₂ is applied to the second section108 of the transfer transistor gate electrode. The slightlypositive-biased second section 108 acts to attract mobile electronsunder the transistor gate and serves to create a path for electrons,which might otherwise cause blooming, to flow to the floating diffusionregion 103, rather than to undesired areas of pixel 100 or to adjacentpixels. The second voltage V₂ may be in the range of about +0.1 to about+1.0 volts.

Next, for performing charge transfer, at step 203, both sections 106,108 of the gate electrode are biased with the same, positive voltage inorder to turn on the transfer transistor to transfer the generatedcharges from the accumulation region 114 to the floating diffusionregion 103. Thus during charge transfer, the transfer transistor 107acts as one gatestack; in contrast with during an integration period,when the transfer transistor 107 acts as though it has two separatelycontrolled gatestacks. In step 204, charges transferred to floatingdiffusion region 103 are applied to the gate of source followertransistor 127 which produces a pixel output signal that is read outthrough row select transistor 137.

FIGS. 5A-5F depict one exemplary method of making a pixel cell 100 inaccordance with the present invention, showing a cross-sectional view ofpart of pixel cell 100. With reference to FIG. 5A, an isolation region109 is formed at least partially in an n-well region of a substrate 102.The isolation region 109 may be formed using any known isolation formingtechniques such as STI or LOCOS. At a top surface of the substrate 102,a layer of gate oxide material 104 is deposited. The gate oxide material104 may be any suitable dielectric material, such as, for example,silicon dioxide. Next, as shown in FIG. 5B, a conductive layer 168 isformed over the gate oxide layer 104. The conductive layer 168 materialmay be any type of suitable electrode material, such as dopedpolysilicon. A photoresist mask/etch step is next performed to eliminatethe gate oxide and conductive material everywhere except for the areawhere the gatestacks for transistors (107, 117) are to be formed. Asecond mask/etch step may then be performed so that the conductive layer168 for the transfer transistor 107 gatestack is split into a first 106and a second 108 section, as shown in FIG. 5C.

An insulating material, such as a tetraethyl orthosilicate (“TEOS”)layer is formed over the surface of the substrate 102 and gatestacks.With reference to FIG. 5D, a photoresist mask/etch step is performed toeliminate the TEOS layer everywhere except over the gatestacks. In orderto reduce the resistance between the electrode sections 106, 108, animplant of phosphorus ions into the TEOS isolation region 110 betweenthe gate electrode sections 106, 108 may be used. An implant dose of2e¹² atoms per cm³ may be sufficient depending on the type of materialsused and the spacing between the electrode sections 106, 108. Next, asshown in FIG. 5E, masked ion implants are selectively introduced intothe substrate to form a large p-well. Appropriate ion implants are thenutilized to form an n-type accumulation region 114 on one side of thetransfer transistor 107, and an n-type diffusion region 103 on the otherside. An n-type source drain region 132 is also created near the surfaceof the substrate 102 for the reset transistor.

Turning to FIG. 5F, a surface p-type region 105 is created by implantingions into the area of the substrate 102 over the accumulation region114. An oxide layer 111 is formed over the top of the substrate 102,thereby creating oxide spacers on each transistor gatestack which may beetched away except at the sides and top of the transistor gatestacks. Atthis stage, the pixel cell 100 is essentially complete. Additionalprocessing steps may be used to form insulating, photo device shielding,and light shielding layers, as desired. For example, a BPSG layer may beformed over the FIG. 5F structure, upon which ILD and metallizationlayers are formed as known in the art.

FIGS. 6-9 show top-down views of pixel cells 200, 300, 400, and 500 inaccordance with other exemplary embodiments of the invention. The onlydifference between these alternative embodiments and the first exemplaryembodiment of pixel cell 100 is the location and arrangement of thetransfer transistor. FIG. 6 shows a second exemplary pixel cell 200,which has two distinct electrode regions 206, 208 separated by anisolation region 210. Each electrode section 206, 208 being located atan angle relative to the photodiode 113, but parallel to one another. Inaccordance with one design of this second exemplary embodiment, thefirst electrode section 206 is thicker in width than the secondelectrode section as shown by the relative thicknesses T₁ and T₂. Forexample, the first electrode section may be approximately 0.3 micronswide and spaced apart from the second electrode section 208 by 0.2microns. The second electrode section 208 may be approximately 0.2microns wide in this exemplary embodiment.

FIG. 7 shows an exemplary pixel cell 300 constructed in accordance witha third exemplary embodiment. Pixel cell 300 has a first electrodesection 306 adapted for connection to one voltage source separated byisolation regions 310 from a second electrode section 308 for connectionto a second voltage source. In this embodiment, the second electrodesection 308 is sandwiched between the first section 306. Specifically,the second electrode section 308 has the same width as the firstelectrode section 306 and effectively creates three electrode sections,two sections 306 connectable to a first voltage source, and the third308 connectable to a second voltage source. In operation of thisexemplary pixel cell 300, the edges of the transfer gate (firstelectrode section 306) are negatively biased to clear out generation ofdark current from the area in the photodiode region 113 near the edge ofthe transfer gatestack edge, where it can be the most problematic. Themiddle of the transfer gatestack is the second electrode section 308which is adapted to receive a positive voltage to provide bloomingprotection for electrons out of the photodiode region 113.

FIG. 8 shows a fourth exemplary embodiment of a pixel cell 400 which hastwo electrode sections 406, 408, running parallel to one another alongthe length of the photodiode region 113. The two electrode sections 406,408 of this embodiment are separated by an isolation region 410.Finally, a fifth exemplary embodiment of a pixel cell 500 is shown inFIG. 9. Pixel cell 500 has a second electrode section 508 within thefirst electrode section 506, again separated by a thin isolation region510. Unlike the third exemplary embodiment of this invention, however,the width of this second electrode section 508 is less than the width ofthe first electrode section 506.

The second through fifth exemplary embodiments of the invention areconstructed using similar fabrication steps discussed above withreference to FIGS. 5A-5F. Also similar to the exemplary pixel cell 100above, the electrode sections for the split transfer gate electrodes forthe second through fifth exemplary cells may be formed of any materialsknown in the art of transistor fabrication. Preferably, phosphorus ionimplants are utilized in the isolation regions 210, 310, 410, 510 toincrease the performance of the gates.

The exemplary pixels of the present invention can be used in a pixelarray 240 of an imager device 318 as shown in FIG. 10. A pixel array 240comprises a plurality of pixels arranged in a predetermined number ofcolumns and rows, with each pixel cell being constructed in accordancewith one of the exemplary embodiments described above. Connected to thearray 240 is signal processing circuitry, at least part of which may beformed in the substrate. The pixels of each row in array 240 are allturned on at the same time by a row select line, and the pixels of eachrow are selectively output by respective column select lines. Aplurality of row and column lines are provided for the entire array 240.The row lines are selectively activated by a row driver 245 in responseto row address decoder 255. The column select lines are selectivelyactivated by a column driver 260 in response to column address decoder270. Thus, a row and column address is provided for each pixel.

The CMOS imager 318 is operated by a timing and control circuit 250,which controls address decoders 255, 270 for selecting the appropriaterow and column lines for pixel readout. The control circuit 250 alsocontrols the row and column driver circuitry 245, 260 such that theyapply driving voltages to the drive transistors of the selected row andcolumn lines. The pixel column signals, which typically include a pixelreset signal (V_(rst)) and a pixel image signal (V_(sig)), are read by asample and hold circuit 261. V_(rst) is read from a pixel 100immediately after the charge storage region 103 (FIG. 3) is reset by thereset gate 117. V_(sig) represents the amount of charges generated bythe photosensitive element 113 in response to applied light to the pixel100. A differential signal (V_(rst)−V_(sig)) is produced for each pixelby differential amplifier 262. The differential signal is digitized byanalog-to-digital converter 275 (ADC). The analog-to-digital converter275 supplies digitized pixel signals to an image processor 280, whichforms and outputs a digital image.

FIG. 11 illustrates a processor-based system 1100 including an imagingdevice 318, which has pixels constructed in accordance with theembodiments described herein. For example, the pixels may be any of theexemplary pixel cells 100, 200, 300, 400, 500 constructed in accordancewith the exemplary embodiments of the invention. The processor-basedsystem 1100 is exemplary of a system having digital circuits that couldinclude image sensor devices. Without being limiting, such a systemcould include a computer system, camera system, scanner, machine vision,vehicle navigation, video phone, surveillance system, auto focus system,star tracker system, motion detection system, image stabilizationsystem, and other digital imaging systems.

The processor-based system 1100, for example a camera system, generallycomprises a central processing unit (CPU) 1102, such as amicroprocessor, that communicates with an input/output (I/O) device 1106over a bus 1104. Imaging device 318 also communicates with the CPU 1102over the bus 1104. The processor-based system 1100 also includes randomaccess memory (RAM) 1110, and can include removable memory 1115, such asflash memory, which also communicates with CPU 1102 over the bus 1104.Imaging device 308 may be combined with a processor, such as a CPU,digital signal processor, or microprocessor, with or without memorystorage on a single integrated circuit or on a different chip than theprocessor. Any of the memory storage devices in the processor-basedsystem 1100 could store software for employing the above-describedmethod.

The above description and drawings are only to be consideredillustrative of exemplary embodiments which achieve the features andadvantages of the invention. Modification of, and substitutions to,specific process conditions and structures can be made without departingfrom the spirit and scope of the invention. Accordingly, the inventionis not to be considered as being limited by the foregoing descriptionand drawings, but is only limited by the scope of the appended claims.

1. A method of forming a pixel cell comprising the acts of: forming aphotosensitive region in a substrate for generating photo-charges;forming a storage region in the substrate for storing the photo-charges;and forming a transistor for transferring the charges from thephotosensitive region to the storage region, comprising the acts of:forming a gate oxide layer at a surface of the substrate; forming firstand second gate electrode sections over the gate oxide layer in alocation between the photosensitive region and the storage region; andforming an isolation region between the first and second gate electrodesections to allow different applied voltages to control the transfertransistor.
 2. The method of claim 1, further comprising the act ofimplanting ions into the isolation region.
 3. The method of claim 2,wherein the act of implanting ions comprises implanting phosphorus ions.4. The method of claim 3, wherein the ion concentration of the implantedphosphorus ions is approximately 2e12 atoms per cm3.
 5. The method ofclaim 1, wherein the act of forming first and second gate electrodescomprises forming a conductive layer and selectively removing portionsof the layer.
 6. The method of claim 1, wherein the act of forming anisolation region between the first and second gate electrodes comprisesforming a TEOS layer over and between the gate electrodes.
 7. The methodof claim 1, further comprising forming a circuit for applying a firstand a second voltage respectively to the first and second gate electrodesections during an integration period for the cell.
 8. The method ofclaim 7, wherein the circuit is adapted to apply a third voltage to boththe first and second gate electrode sections during charge transfer. 9.A method of forming an imager circuit comprising the acts of: forming aphotosensitive area in a substrate; forming a charge storage region inthe substrate; and forming a transfer transistor having a gatestack fortransferring charge from said photosensitive area to said charge storageregion, said forming of said transfer transistor comprising the acts of:forming first and second gate electrode sections located above thesubstrate; and forming an isolation region located between the first andsecond electrode sections to allow different applied voltages to controlthe transfer transistor; and forming a voltage supply circuit capable ofsupplying a first voltage to the first gate electrode section and asecond different voltage to the second gate electrode section during acharge integration period.
 10. The method of claim 9, furthercomprising: forming said voltage supply circuit such that it supplies athird common voltage to said first and second gate electrode sectionsduring a charge transfer period.
 11. The method of claim 9, whereinforming a photosensitive area comprises forming a photodiode and forminga charge storage region comprises forming a floating diffusion region inthe substrate.